Qbit labs Incorporation

Full IEEE 802.11ax Compliance: Supports all mandatory PHY and MAC layer features of Wi-Fi 6.
Backward Compatibility: Interoperable with 802.11a/b/g/n/ac devices for seamless coexistence.
High Throughput and Low Latency: Up to 9.6 Gbps aggregated throughput using 8 spatial streams and 160 MHz channels.
OFDMA Support (Uplink & Downlink): Efficient channel utilization across multiple users in dense environments.
MU-MIMO (Multi-User MIMO): Supports up to 8x8 MU-MIMO for simultaneous user communication.
1024-QAM Modulation: Enhances spectral efficiency for higher data rates.
Target Wake Time (TWT): Reduces power consumption by scheduling wake/sleep cycles for devices.
BSS Coloring: Differentiates overlapping networks to minimize co-channel interference.
Dual Band Support: Operates over both 2.4 GHz and 5 GHz bands; optional 6 GHz support for Wi-Fi 6E.
MAC Layer Enhancements: Enhanced reliability, QoS (WMM), dynamic bandwidth allocation, and link adaptation.
Highly Configurable PHY/MAC Layer Interfaces: Customizable for integration into various SoC or FPGA designs.

Maximum Wireless Efficiency: OFDMA and MU-MIMO dramatically improve spectral usage in high-density deployments.
Power-Efficient Design: TWT and MAC layer enhancements enable ultra-low power operation, ideal for IoT and wearable devices.
Extended Coverage and Higher Reliability: Uplink enhancements, beamforming, and BSS coloring ensure strong signal performance in complex environments.
Reduced System Load: Hardware offload of key MAC/PHY functions lightens processor burden and lowers latency.
Scalable Integration: IP core is modular, configurable, and adaptable for both low-end and high-end wireless chipsets.
Faster Time-to-Market: Delivered with pre-verified designs, documentation, and testbenches for faster development cycles.
Secure and Robust: Supports WPA3, Protected Management Frames (PMF), and other security enhancements.

FPGA: Optimized for Xilinx UltraScale+, Intel Agilex, and mid-range devices
ASIC: Ready for tape-out in 7nm, 5nm, and 3nm process nodes
Integration: Compatible with embedded processors (ARM, RISC-V), custom accelerators, and SoC/NoC fabrics

Overview